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CMC MATERIALS & DESIGN (Composite Mark)

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CMC MATERIALS & DESIGN (Composite Mark)
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Last Applicant/ Owned by

CMC MATERIALS, INC.

870 N. Commons DriveAurora, IL 60504

US

Serial Number

2000598 filed on 11th Dec 2019

Correspondent Address

MILLER IP LAW

84 Neilson DriveToronto

ONTARIO

CA

M9C1V7

CMC MATERIALS & DESIGN (Composite Mark)

Trademark usage description

polishing slurry for semiconductors; polishing consumables, namely polishing slurries, for use in the semiconductor, electronic, rigid disk and magnet Read More

Vienna Information

26 . 11 . 1

One line or one bandUne ligne ou une bande

26 . 11 . 5

Thin linesLignes fines

26 . 11 . 8

Horizontal lines or bandsLignes ou bandes horizontales

26 . 11 . 10

Straight lines or bandsLignes ou bandes droites

26 . 11 . 13

Wavy lines or bands, zigzag lines or bandsLignes ou bandes ondulées, en dents de scie

27 . 5 . 1

Letters presenting a special form of writingLettres présentant un graphisme spécial

27 . 5 . 4

Letters embellished or decorated with a drawing or composed of a collection of drawingsLettres enjolivées ou ornées d'un dessin ou composées par un assemblage de dessins

Classification Information

Class [001]
Polishing slurry for semiconductors; Polishing consumables, namely polishing slurries, for use in the semiconductor, electronic, rigid disk and magnetic head industries; Chemical mechanical polishing slurries used for the treatment of semiconductors to planarize, smooth, or otherwise modify their chemical-mechanical properties; Polishing slurries used for the treatment of semiconductors to planarize, smooth or otherwise modify their mechanical, physical, chemical and electrical properties; Chemical solutions for use in the manufacturing and processing of semiconductors, namely, photoresist stripper, benotriazole (bta), and l-proline solution; Fumed silica dispensed in water used to polish semiconductors; Aqueous metal oxide dispersions for use in semiconductor polishing; Chemical additives, namely, abrasive dispersions for use in the manufacture of electronic components and substrates, optical components, metals, machinery, computer parts, and magnetic data-storage disks and heads; Polishing slurry used in the manufacture of advanced integrated circuit devices within the semi-conductor industry; High purity chemical compositions for electronic component manufacture; Chemical compositions for use in semiconductor manufacturing, solar cell panel manufacturing and flat panel display manufacturing; Chemical compositions for removal of photoresist and post-etch residues in the manufacture of semiconductors, integrated circuits and related products; Chemicals for use in industry and science; Chemical products for use in industry and science, namely for use in the semiconductor and micro-electronics industries; Chemicals and chemical blends for use in the oil and gas drilling, processing and exploration industry; Chemicals, namely polymer-containing drag reducers and flow improves to increase flow of hydrocarbons through pipelines; Chemicals for use in industrial wood treating applications; Chemicals for use in treating utility poles and cross-arms

Classification kind code

11

Class [003]
Chemical mechanical polishing (cmp) slurry and chemical mechanical planarization (cmp) slurry for use in the manufacturing and processing of semiconductors in the optoelectronics and photonics industries; Chemical mechanical polishing slurry for liquid crystal display (lcd), organic light emitting diodes (o-led), light emitting diode (led), glass thinning, and hard disk; Abrasive compounds for lapping and polishing semiconductors, silicon wafers, glass and metal surfaces; Cleaner for use in electronics industry; Pad cleaning solution for use in the manufacturing and processing of semiconductors; Post-copper chemical mechanical planarization (cmp) cleaning solution for use in the manufacturing and processing of semiconductors; Cleaning solution for processing of integrated circuit (ic) in the opto-electronics and photonics industries; Post-ash cleaning solution for use in the manufacturing and processing of semiconductors; Abrasive preparations, namely, chemical cleaners, namely, abrasive dispersion slurries and cleaning and polishing preparations for use in the finishing of electronic components and substrates, optical components, glass, metals, plastics, machinery, computer parts, magnetic data-storage disks and heads

Classification kind code

11

Class [004]
Valve lubricants and sealants for the oil and gas storage, pipeline and gas distribution markets; industrial sealants and lubricants

Classification kind code

11

Class [005]
Herbicide

Classification kind code

11

Class [007]
Non-abrasive polishing pads for chemical-mechanical planarizing or chemical mechanical polishing (cmp) machines for use in the manufacture of semiconductor wafers, integrated circuits, hard disk drives and chipsets; Polishing pads for polishing machines for use in the manufacture of semiconductor wafers, integrated circuits, hard disk drives and chipsets; Polishing pads for use in the manufacture of advanced integrated circuit devices within the semiconductor industry; Lubrication equipment used to service industrial valves in the oil and gas, chemical, and oilfield/wellhead industries and to service industrial gas distribution systems

Classification kind code

11

Class [037]
Leasing of oil and gas drilling equipment

Classification kind code

11

Mark Details

Serial Number

2000598

Mark Type

Trademark

Legal History

Action TakenStatus
Submitted for opposition 14
on 30th Dec 2024		Default Notice Sent
Submitted for opposition 22
on 12th Jun 2024		Search Recorded
Submitted for opposition 20
on 12th Jun 2024		Examiner's First Report
Submitted for opposition 287
on 6th Jun 2022		Pre-Assessment Letter Sent
Submitted for opposition 135
on 9th Jun 2021		Amendment to Application
Submitted for opposition 31
on 3rd Jan 2020		Formalized
Submitted for opposition 1
on 12th Dec 2019		Created
Submitted for opposition 30
on 11th Dec 2019		Filed