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HYDROBLADE

View On IC.GC.CA

REGISTERED

on 12 Mar 2025

Last Applicant/ Owned by

TMGCore, LLC

6815 Communications ParkwayPlano, TX 75024

Serial Number

2110707 filed on 31^st May 2021

Registration Number

TMA1297920 registered on 12^th Mar 2025

Registration expiry Date

12^th Mar 2035

Correspondent Address

SMART & BIGGAR LP

Scotia Plaza, 40 King Street West40th FloorToronto

ONTARIO

M5H3Y2

HYDROBLADE

Trademark usage description

computing components, namely, servers, for use in a computing system comprised of data centers and modular servers and enclosures, for use in computin Read More

Classification Information

Class [009]
Computing components, namely, servers, for use in a computing system comprised of data centers and modular servers and enclosures, for use in computing in immersion cooled environments with dielectric fluid

Classification kind code

Mark Details

Serial Number

2110707

Mark Type

Trademark

Legal History

Action Taken	Status
Submitted for opposition 190 on 12^th Mar 2025	Registration Pending
Submitted for opposition 42 on 25^th Dec 2024	Advertised
Submitted for opposition 27 on 28^th Nov 2024	Approval Notice Sent
Submitted for opposition 26 on 28^th Nov 2024	Approved
Submitted for opposition 22 on 20^th Nov 2024	Search Recorded
Submitted for opposition 67 on 29^th Sept 2023	Agent Name Changed
Submitted for opposition 287 on 5^th Jul 2022	Pre-Assessment Letter Sent
Submitted for opposition 30 on 31^st May 2021	Filed
Submitted for opposition 1 on 31^st May 2021	Created
Submitted for opposition 31 on 31^st May 2021	Formalized

HYDROBLADE

Classification Information

Class [009]Computing components, namely, servers, for use in a computing system comprised of data centers and modular servers and enclosures, for use in computing in immersion cooled environments with dielectric fluid

Classification kind code

Mark Details

Serial Number

Mark Type

Legal History

Class [009]
Computing components, namely, servers, for use in a computing system comprised of data centers and modular servers and enclosures, for use in computing in immersion cooled environments with dielectric fluid