LIGENT Design

Class [009]
Optical transceivers; Cable connectors; Optical transmitters; Computer network server; Fiber-optic transceivers; Fiber interconnection cable; Optical cables; Semiconductor lasers used for the creation of silicon photonic chips and wafers and semiconductor chips and wafers; Optical assemblies, namely, optical lens units composed of optical lenses installed in lens-barrels being body-tubes for camera modules for smartphones, virtual reality goggles and vehicle cameras; Thermal imaging goods, namely, lightpath thermal imaging lenses, and thermal imaging scanner optical assemblies; Silicon photonics chips; Silicon photonics optical engines, namely monolithic electronic and photonic integrated circuits; Vertical cavity surface emitting laser; Electro-absorption modulated laser; Optical components, other than for medical use, namely, optical sub-assembly transmitter and receivers and optical laser; Bidirectional optical sub assembly; Network communication equipment namely optical network terminal, optical network unit and customer premise equipment; Transmitting sets for telecommunication namely optical network terminal, optical network unit and customer premise equipment; Telecommunications equipment, namely, optical network units and optical line terminal communications devices that enable an interface between a fiber optic network and other copper or fiber communications networks for transporting and aggregating voice, data, and video communications via fiber networks across multiple network infrastructures and communications protocols; Laser diodes; Fiber-to-the-home and ethernet-over-VDSL access aggregators, terminators and repeaters; Cables for electrical and optical signal transmission; Optical character readers; Electro-optic transducers; Photodiodes; DNA chips; Gene chips; Computer chips; Semiconductor chips; Radar transmitters; Radar receivers.