OCTOPOD

Trademark usage description

prefabricated building for high-performance computing (hpc) operations made substantially of metal direct-to-chip cooling systems for high-performanc Read More

Classification Information

Class [006]
Prefabricated building for high-performance computing (HPC) operations made substantially of metal

Classification kind code

Class [009]
Direct-to-chip cooling systems for high-performance computing (HPC) systems, namely liquid cooling systems, air cooling systems, and heat sinks; Smart electric power distribution units (PDU); Power distribution system for modular computer components for use in high-performance computing (HPC) operations; Power distribution system consisting of electric cables, electric switches, electric breakers, electric control panel; electric relays; electric connectors; electric connector housings; electric transformers

Classification kind code

Class [011]
Liquid immersion cooling systems comprised of liquid baths and air-cooled heat exchangers for computer components for use in high-performance computing (HPC) operations

Classification kind code

Mark Details

Serial Number

2323810

Mark Type

Trademark

Legal History

Action Taken	Status
Submitted for opposition 287 on 9^th May 2024	Pre-Assessment Letter Sent
Submitted for opposition 30 on 25^th Apr 2024	Filed
Submitted for opposition 1 on 25^th Apr 2024	Created
Submitted for opposition 31 on 25^th Apr 2024	Formalized

OCTOPOD

Classification Information

Class [006]Prefabricated building for high-performance computing (HPC) operations made substantially of metal

Classification kind code

Classification kind code

Class [011]Liquid immersion cooling systems comprised of liquid baths and air-cooled heat exchangers for computer components for use in high-performance computing (HPC) operations

Classification kind code

Mark Details

Serial Number

Mark Type

Legal History

Class [006]
Prefabricated building for high-performance computing (HPC) operations made substantially of metal

Class [011]
Liquid immersion cooling systems comprised of liquid baths and air-cooled heat exchangers for computer components for use in high-performance computing (HPC) operations