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ONTO INNOVATION

View On IC.GC.CA

REGISTERED

on 23 Sept 2024

Last Applicant/ Owned by

ONTO INNOVATION INC.

16 Jonspin RoadWilmington MA 01887

Serial Number

2183419 filed on 9^th Jul 2021

Registration Number

TMA1257811 registered on 23^rd Sept 2024

Registration expiry Date

9^th Jul 2031

Correspondent Address

BORDEN LADNER GERVAIS LLP

Bay Adelaide Centre, East Tower22 Adelaide St. WestTORONTO

ONTARIO

M5H4E3

ONTO INNOVATION

Trademark usage description

lithography machines for the manufacture of microelectronics, integrated circuits, light emitting diodes, and semiconductors on laminar substrates inc Read More

Vienna Information

29 . 1 . 1

Red, pink, orangeRouge, rose, orangé

Classification Information

Class [007]
Lithography machines for the manufacture of microelectronics, integrated circuits, light emitting diodes, and semiconductors on laminar substrates including wafers, glass panels, and packaging panels such as copper plate or plastic; optical metrology, characterization, and inspection systems comprised of a machine and machine components for use in the production of laminar substrates namely discrete electronic components, semiconductors including non-volatile and volatile memory devices, foundry and logic devices, asic devices, cmos image sensors, microelectromechanical systems, light emitting diodes, and other micro and nano technology devices, namely transistors, capacitors, resistors, and inductors, advanced packaging electronics technologies, namely system-in-package (SIP) and fan-out packages, chiplets, heterogeneous packaging namely packaging comprising two different substrates, hybrid bonding, bumping, 3D structures, and scaling; optical metrology, characterization, and inspection systems comprised of machine and components for use in the production of precision machined optical surfaces, optical coatings, and optical assemblies including reference flat, sphere, asphere and assemblies composed of both refractive and reflective components.

Classification kind code

Class [009]
Optical metrology, characterization, and inspection systems comprised of pre-installed operating software and machine components therefor sold as a unit for use in the testing of transmitted wavefront and surface shape of optical components, surface roughness of optics, metals, semiconductors, ceramics, plastics, paints and other finely finished materials, and defects and geometries of parts in aerospace, automotive, power generation, semiconductor, data storage, bearings, additive manufacturing and other precision-machined components; interferometers for use in the testing of transmitted wavefront and surface shape of optical components, surface roughness of optics, metals, semiconductors, ceramics, plastics, paints and other finely finished materials, and defects and geometries of parts in aerospace, automotive, power generation, semiconductor, data storage, bearings, additive manufacturing and other precision-machined components; downloadable software, namely, process control and defect analysis software for use in the production of laminar substrates namely discrete electronic components, semiconductors including non-volatile and volatile memory devices, foundry and logic devices, asic devices, cmos image sensors, microelectromechanical systems, light emitting diodes, and other micro and nano technology devices, namely transistors, capacitors, resistors, and inductors, advanced packaging electronics technologies, namely system-in-package (SIP) and fan-out packages, chiplets, heterogeneous packaging namely packaging comprising two different substrates, hybrid bonding, bumping, 3D structures, and scaling; operating software for optical metrology, characterization, and inspection systems for use in the production of laminar substrates namely discrete electronic components, semiconductors including non-volatile and volatile memory devices, foundry and logic devices, asic devices, cmos image sensors, microelectromechanical systems, light emitting diodes, and other micro and nano technology devices, namely transistors, capacitors, resistors, and inductors, advanced packaging electronics technologies, namely system-in-package (SIP) and fan-out packages, chiplets, heterogeneous packaging, namely packaging comprising two different substrates, hybrid bonding, bumping, 3D structures, and scaling; operating software for optical metrology, characterization, and inspection systems for use in the production of precision machined optical surfaces, optical coatings, and optical assemblies including reference flat, sphere, asphere and assemblies composed of both refractive and reflective components

Classification kind code

Class [042]
Providing temporary use on online, nondownloadable process control and defect analysis software for use in the production of laminar substrates namely discrete electronic components, semiconductors including non-volatile and volatile memory devices, foundry and logic devices, asic devices, cmos image sensors, microelectromechanical systems, light emitting diodes, and other micro and nano technology devices, namely transistors, capacitors, resistors and inductors, advanced packaging electronics technologies, namely system-in-package (SIP) and fan-out packages, chiplets, heterogenous packaging namely packaging comprising two different substrates, hybrid bonding, bumping, 3D structures, and scaling.

Classification kind code

Mark Details

Serial Number

2183419

Mark Type

Trademark

Legal History

Action Taken	Status
Submitted for opposition 22 on 30^th Mar 2023	Search Recorded
Submitted for opposition 20 on 30^th Mar 2023	Examiner's First Report
Submitted for opposition 223 on 30^th Mar 2023	Total Provisional Refusal
Submitted for opposition 48 on 10^th Mar 2023	Agent Changed
Submitted for opposition 256 on 6^th Mar 2023	Notification of Possible Opposition Sent
Submitted for opposition 257 on 5^th May 2022	Designation Notification - Madrid Protocol
Submitted for opposition 31 on 5^th May 2022	Formalized
Submitted for opposition 1 on 5^th May 2022	Created
Submitted for opposition 228 on 9^th Jul 2021	International Registration
Submitted for opposition 30 on 9^th Jul 2021	Filed