on 9 Aug 2024
Last Applicant/ Owned by
NIHON SUPERIOR CO. LTD.
16-15, Esaka-cho 1-chome,Suita-shiOsaka 564-0063
JP
Serial Number
2250304 filed on 24th Feb 2023
Registration Number
TMA1250339 registered on 9th Aug 2024
Registration expiry Date
24th Feb 2033Trademark usage description
solder alloys; solder pastes; soldering wire of metal; solders in the form of washer, ring, pellet, powder, ribbon, ball, wire or bar; solder preforms Read More12
2250304
Trademark
Action Taken | Status |
---|---|
Submitted for opposition 42 on 22nd May 2024 | Advertised |
Submitted for opposition 26 on 29th Apr 2024 | Approved |
Submitted for opposition 27 on 29th Apr 2024 | Approval Notice Sent |
Submitted for opposition 22 on 23rd Apr 2024 | Search Recorded |
Submitted for opposition 256 on 6th Feb 2024 | Notification of Possible Opposition Sent |
Submitted for opposition 257 on 6th Apr 2023 | Designation Notification - Madrid Protocol |
Submitted for opposition 1 on 5th Apr 2023 | Created |
Submitted for opposition 31 on 5th Apr 2023 | Formalized |
Submitted for opposition 228 on 24th Feb 2023 | International Registration |
Submitted for opposition 30 on 24th Feb 2023 | Filed |