Lithography machines for the manufacture of microelectronics, integrated circuits, light emitting diodes, and semiconductors on laminar substrates including wafers, glass panels, and packaging panels such as copper plate or plastic; optical metrology, characterization, and inspection systems comprised of a machine, machine components and operating software therefor sold as a unit for use in the production of laminar substrates namely discrete electronic components, semiconductors including non-volatile and volatile memory devices, foundry and logic devices, asic devices, cmos image sensors, microelectromechanical systems, light emitting diodes, and other micro and nano technology devices, namely transistors, capacitors, resistors, and inductors, advanced packaging electronics technologies, namely system -in -package (SIP) and fan-out packages, chiplets, heterogeneous packaging namely packaging comprising two different substrates, hybrid bonding, bumping, 3D structures, and scaling; optical metrology, characterization, and inspection systems comprised of a machine and machine components and pre-installed operating software therefor sold as a unit for use in the production of precision machined optical surfaces, optical coatings, and optical assemblies including reference flat, sphere, asphere and assemblies composed of both refractive and reflective components.

Optical metrology, characterization, and inspection systems comprised of pre-installed operating software and machine components therefor sold as a unit for use in the testing of transmitted wavefront and surface shape of optical components, surface roughness of optics, metals, semiconductors, ceramics, plastics, paints and other finely finished materials, and defects and geometries of parts in aerospace, automotive, power generation, semiconductor, data storage, bearings, additive manufacturing and other precision-machined components; interferometers for use in the testing of transmitted wavefront and surface shape of optical components, surface roughness of optics, metals, semiconductors, ceramics, plastics, paints and other finely finished materials, and defects and geometries of parts in aerospace, automotive, power generation, semiconductor, data storage, bearings, additive manufacturing and other precision-machined components; downloadable software, namely, process control and defect analysis software for use in the production of laminar substrates namely discrete electronic components, semiconductors including non-volatile and volatile memory devices, foundry and logic devices, asic devices, cmos image sensors, microelectromechanical systems, light emitting diodes, and other micro and nano technology devices, namely transistors, capacitors, resistors, and inductors, advanced packaging electronics technologies, namely system -in -package (SIP) and fan-out packages, chiplets, heterogeneous packaging namely packaging comprising two different substrates, hybrid bonding, bumping, 3D structures, and scaling.

Lithography machines for the manufacture of microelectronics, integrated circuits, light emitting diodes, and semiconductors on laminar substrates including wafers, glass panels, and packaging panels such as copper plate or plastic; optical metrology, characterization, and inspection systems comprised of a machine and machine components for use in the production of laminar substrates namely discrete electronic components, semiconductors including non-volatile and volatile memory devices, foundry and logic devices, asic devices, cmos image sensors, microelectromechanical systems, light emitting diodes, and other micro and nano technology devices, namely transistors, capacitors, resistors, and inductors, advanced packaging electronics technologies, namely system-in-package (SIP) and fan-out packages, chiplets, heterogeneous packaging namely packaging comprising two different substrates, hybrid bonding, bumping, 3D structures, and scaling; optical metrology, characterization, and inspection systems comprised of machine and components for use in the production of precision machined optical surfaces, optical coatings, and optical assemblies including reference flat, sphere, asphere and assemblies composed of both refractive and reflective components.

Optical metrology, characterization, and inspection systems comprised of pre-installed operating software and machine components therefor sold as a unit for use in the testing of transmitted wavefront and surface shape of optical components, surface roughness of optics, metals, semiconductors, ceramics, plastics, paints and other finely finished materials, and defects and geometries of parts in aerospace, automotive, power generation, semiconductor, data storage, bearings, additive manufacturing and other precision-machined components; interferometers for use in the testing of transmitted wavefront and surface shape of optical components, surface roughness of optics, metals, semiconductors, ceramics, plastics, paints and other finely finished materials, and defects and geometries of parts in aerospace, automotive, power generation, semiconductor, data storage, bearings, additive manufacturing and other precision-machined components; downloadable software, namely, process control and defect analysis software for use in the production of laminar substrates namely discrete electronic components, semiconductors including non-volatile and volatile memory devices, foundry and logic devices, asic devices, cmos image sensors, microelectromechanical systems, light emitting diodes, and other micro and nano technology devices, namely transistors, capacitors, resistors, and inductors, advanced packaging electronics technologies, namely system-in-package (SIP) and fan-out packages, chiplets, heterogeneous packaging namely packaging comprising two different substrates, hybrid bonding, bumping, 3D structures, and scaling; operating software for optical metrology, characterization, and inspection systems for use in the production of laminar substrates namely discrete electronic components, semiconductors including non-volatile and volatile memory devices, foundry and logic devices, asic devices, cmos image sensors, microelectromechanical systems, light emitting diodes, and other micro and nano technology devices, namely transistors, capacitors, resistors, and inductors, advanced packaging electronics technologies, namely system-in-package (SIP) and fan-out packages, chiplets, heterogeneous packaging, namely packaging comprising two different substrates, hybrid bonding, bumping, 3D structures, and scaling; operating software for optical metrology, characterization, and inspection systems for use in the production of precision machined optical surfaces, optical coatings, and optical assemblies including reference flat, sphere, asphere and assemblies composed of both refractive and reflective components

Lithography machines for the manufacture of microelectronics, integrated circuits, light emitting diodes, and semiconductors on laminar substrates including wafers, glass panels, and packaging panels such as copper plate or plastic; optical metrology, characterization, and inspection systems comprised of a machine, machine components and operating software therefor sold as a unit for use in the production of laminar substrates namely discrete electronic components, semiconductors including non-volatile and volatile memory devices, foundry and logic devices, asic devices, cmos image sensors, microelectromechanical systems, light emitting diodes, and other micro and nano technology devices, namely transistors, capacitors, resistors, and inductors, advanced packaging electronics technologies, namely system -in -package (SIP) and fan-out packages, chiplets, heterogeneous packaging namely packaging comprising two different substrates, hybrid bonding, bumping, 3D structures, and scaling; optical metrology, characterization, and inspection systems comprised of a machine and machine components and pre-installed operating software therefor sold as a unit for use in the production of precision machined optical surfaces, optical coatings, and optical assemblies including reference flat, sphere, asphere and assemblies composed of both refractive and reflective components.

Optical metrology, characterization, and inspection systems comprised of pre-installed operating software and machine components therefor sold as a unit for use in the testing of transmitted wavefront and surface shape of optical components, surface roughness of optics, metals, semiconductors, ceramics, plastics, paints and other finely finished materials, and defects and geometries of parts in aerospace, automotive, power generation, semiconductor, data storage, bearings, additive manufacturing and other precision-machined components; interferometers for use in the testing of transmitted wavefront and surface shape of optical components, surface roughness of optics, metals, semiconductors, ceramics, plastics, paints and other finely finished materials, and defects and geometries of parts in aerospace, automotive, power generation, semiconductor, data storage, bearings, additive manufacturing and other precision-machined components; downloadable software, namely, process control and defect analysis software for use in the production of laminar substrates namely discrete electronic components, semiconductors including non-volatile and volatile memory devices, foundry and logic devices, asic devices, cmos image sensors, microelectromechanical systems, light emitting diodes, and other micro and nano technology devices, namely transistors, capacitors, resistors, and inductors, advanced packaging electronics technologies, namely system -in -package (SIP) and fan-out packages, chiplets, heterogeneous packaging namely packaging comprising two different substrates, hybrid bonding, bumping, 3D structures, and scaling.

Wines.

Wholesale and retail services, namely, the sale and distribution of alcoholic and non-alcoholic beverages; direct marketing and direct selling services, namely, the supply of alcoholic and non-alcoholic beverages including by mail order and by electronic means; promotion services, namely, arranging exhibitions and tasting events in respect of wines; after-sales services in respect of wines, namely, replenishment, re-corking and re-packaging of bottled wine, refurbishment and reinstatement of wines, assessing the quality of bottled wines and assessment of wines.

Cups and mugs; drink coasters; drinking bottles for sports; drinking cups; drinking flasks; drinking glasses; drinking saucers; drinking steins; drinking straws; tumbler drinking glasses

Shirts; t-shirts; tee-shirts

Deodorant and de-odor-cream, namely, antiperspirants and deodorants for personal use, deodorants for body care, and cream deodorants for personal use.

Candles.

Shirts, t-shirts, mugs, cloth bags, guitar picks, guitar bags, and stationary items namely pens, labels, stickers, badges, note books, binders, envelopes.

In-home music lessons and studio music lesson services.

Hair care preparations

Online sales of clothing; sale of clothing

The term "Lady King", and the meaning of this graphic is to identify, and proclaim your own Sovereignty. It is a statement you are making to yourself and to others if you wear any product that has this design. I plan to do an advertising campaign about "Lady King" on social media, and news print. My plan for this graphic that I designed, is to print it onto t-shirts, and coffee mugs. I have already used the image on a pendant (Jewelry). The inspiration of this graphic is the Queen Margareth the 1st. She was called the "Lady King". She lived in the 1300's, and was credited for Uniting Scandinavia. The "Crown" was part of her royal coat of arms, and the "Wings" were inspired by images of Valkarie wings.