2 Trademark Results found for "ONTO INNOVATION"

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Mark	Details	Status	Class/Description
	ONTO INNOVATION ONTO INNOVATION INC. 2183419 9 Jul 2021	REGISTERED on 23 Sept 2024	Lithography machines for the manufacture of microelectronics, integrat... Class 007 Class 007 Machinery Products Lithography machines for the manufacture of microelectronics, integrated circuits, light emitting diodes, and semiconductors on laminar substrates including wafers, glass panels, and packaging panels such as copper plate or plastic; optical metrology, characterization, and inspection systems comprised of a machine and machine components for use in the production of laminar substrates namely discrete electronic components, semiconductors including non-volatile and volatile memory devices, foundry and logic devices, asic devices, cmos image sensors, microelectromechanical systems, light emitting diodes, and other micro and nano technology devices, namely transistors, capacitors, resistors, and inductors, advanced packaging electronics technologies, namely system-in-package (SIP) and fan-out packages, chiplets, heterogeneous packaging namely packaging comprising two different substrates, hybrid bonding, bumping, 3D structures, and scaling; optical metrology, characterization, and inspection systems comprised of machine and components for use in the production of precision machined optical surfaces, optical coatings, and optical assemblies including reference flat, sphere, asphere and assemblies composed of both refractive and reflective components. Class 009 Class 009 Computer & Software Products & Electrical & Scientific Products Optical metrology, characterization, and inspection systems comprised of pre-installed operating software and machine components therefor sold as a unit for use in the testing of transmitted wavefront and surface shape of optical components, surface roughness of optics, metals, semiconductors, ceramics, plastics, paints and other finely finished materials, and defects and geometries of parts in aerospace, automotive, power generation, semiconductor, data storage, bearings, additive manufacturing and other precision-machined components; interferometers for use in the testing of transmitted wavefront and surface shape of optical components, surface roughness of optics, metals, semiconductors, ceramics, plastics, paints and other finely finished materials, and defects and geometries of parts in aerospace, automotive, power generation, semiconductor, data storage, bearings, additive manufacturing and other precision-machined components; downloadable software, namely, process control and defect analysis software for use in the production of laminar substrates namely discrete electronic components, semiconductors including non-volatile and volatile memory devices, foundry and logic devices, asic devices, cmos image sensors, microelectromechanical systems, light emitting diodes, and other micro and nano technology devices, namely transistors, capacitors, resistors, and inductors, advanced packaging electronics technologies, namely system-in-package (SIP) and fan-out packages, chiplets, heterogeneous packaging namely packaging comprising two different substrates, hybrid bonding, bumping, 3D structures, and scaling; operating software for optical metrology, characterization, and inspection systems for use in the production of laminar substrates namely discrete electronic components, semiconductors including non-volatile and volatile memory devices, foundry and logic devices, asic devices, cmos image sensors, microelectromechanical systems, light emitting diodes, and other micro and nano technology devices, namely transistors, capacitors, resistors, and inductors, advanced packaging electronics technologies, namely system-in-package (SIP) and fan-out packages, chiplets, heterogeneous packaging, namely packaging comprising two different substrates, hybrid bonding, bumping, 3D structures, and scaling; operating software for optical metrology, characterization, and inspection systems for use in the production of precision machined optical surfaces, optical coatings, and optical assemblies including reference flat, sphere, asphere and assemblies composed of both refractive and reflective components ... Class 042 Computer & Software Services & Scientific Services Providing temporary use on online, nondownloadable process control and defect analysis software for use in the production of laminar substrates namely discrete electronic components, semiconductors including non-volatile and volatile memory devices, foundry and logic devices, asic devices, cmos image sensors, microelectromechanical systems, light emitting diodes, and other micro and nano technology devices, namely transistors, capacitors, resistors and inductors, advanced packaging electronics technologies, namely system-in-package (SIP) and fan-out packages, chiplets, heterogenous packaging namely packaging comprising two different substrates, hybrid bonding, bumping, 3D structures, and scaling.
	ONTO INNOVATION ONTO INNOVATION INC. 2023842 12 Nov 2019	REGISTERED on 23 Sept 2024	Lithography machines for the manufacture of microelectronics, integrat... Class 007 Class 007 Machinery Products Lithography machines for the manufacture of microelectronics, integrated circuits, light emitting diodes, and semiconductors on laminar substrates including wafers, glass panels, and packaging panels such as copper plate or plastic; optical metrology, characterization, and inspection systems comprised of a machine, machine components and operating software therefor sold as a unit for use in the production of laminar substrates namely discrete electronic components, semiconductors including non-volatile and volatile memory devices, foundry and logic devices, asic devices, cmos image sensors, microelectromechanical systems, light emitting diodes, and other micro and nano technology devices, namely transistors, capacitors, resistors, and inductors, advanced packaging electronics technologies, namely system -in -package (SIP) and fan-out packages, chiplets, heterogeneous packaging namely packaging comprising two different substrates, hybrid bonding, bumping, 3D structures, and scaling; optical metrology, characterization, and inspection systems comprised of a machine and machine components and pre-installed operating software therefor sold as a unit for use in the production of precision machined optical surfaces, optical coatings, and optical assemblies including reference flat, sphere, asphere and assemblies composed of both refractive and reflective components. Class 009 Class 009 Computer & Software Products & Electrical & Scientific Products Optical metrology, characterization, and inspection systems comprised of pre-installed operating software and machine components therefor sold as a unit for use in the testing of transmitted wavefront and surface shape of optical components, surface roughness of optics, metals, semiconductors, ceramics, plastics, paints and other finely finished materials, and defects and geometries of parts in aerospace, automotive, power generation, semiconductor, data storage, bearings, additive manufacturing and other precision-machined components; interferometers for use in the testing of transmitted wavefront and surface shape of optical components, surface roughness of optics, metals, semiconductors, ceramics, plastics, paints and other finely finished materials, and defects and geometries of parts in aerospace, automotive, power generation, semiconductor, data storage, bearings, additive manufacturing and other precision-machined components; downloadable software, namely, process control and defect analysis software for use in the production of laminar substrates namely discrete electronic components, semiconductors including non-volatile and volatile memory devices, foundry and logic devices, asic devices, cmos image sensors, microelectromechanical systems, light emitting diodes, and other micro and nano technology devices, namely transistors, capacitors, resistors, and inductors, advanced packaging electronics technologies, namely system -in -package (SIP) and fan-out packages, chiplets, heterogeneous packaging namely packaging comprising two different substrates, hybrid bonding, bumping, 3D structures, and scaling. ... Class 042 Computer & Software Services & Scientific Services Providing temporary use on online, nondownloadable process control and defect analysis software for use in the production of laminar substrates namely discrete electronic components, semiconductors including non-volatile and volatile memory devices, foundry and logic devices, asic devices, cmos image sensors, microelectromechanical systems, light emitting diodes, and other micro and nano technology devices, namely transistors, capacitors, resistors and inductors, advanced packaging electronics technologies, namely system -in -package (SIP) and fan-out packages, chiplets, heterogeneous packaging namely packaging comprising two different substrates, hybrid bonding, bumping, 3D structures, and scaling.

REGISTERED

on 23 Sept 2024

ONTO INNOVATION

ONTO INNOVATION INC.

2183419 · 9 Jul 2021

007

009

Class 009

Computer & Software Products & Electrical & Scientific Products

Optical metrology, characterization, and inspection systems comprised of pre-installed operating software and machine components therefor sold as a unit for use in the testing of transmitted wavefront and surface shape of optical components, surface roughness of optics, metals, semiconductors, ceramics, plastics, paints and other finely finished materials, and defects and geometries of parts in aerospace, automotive, power generation, semiconductor, data storage, bearings, additive manufacturing and other precision-machined components; interferometers for use in the testing of transmitted wavefront and surface shape of optical components, surface roughness of optics, metals, semiconductors, ceramics, plastics, paints and other finely finished materials, and defects and geometries of parts in aerospace, automotive, power generation, semiconductor, data storage, bearings, additive manufacturing and other precision-machined components; downloadable software, namely, process control and defect analysis software for use in the production of laminar substrates namely discrete electronic components, semiconductors including non-volatile and volatile memory devices, foundry and logic devices, asic devices, cmos image sensors, microelectromechanical systems, light emitting diodes, and other micro and nano technology devices, namely transistors, capacitors, resistors, and inductors, advanced packaging electronics technologies, namely system-in-package (SIP) and fan-out packages, chiplets, heterogeneous packaging namely packaging comprising two different substrates, hybrid bonding, bumping, 3D structures, and scaling; operating software for optical metrology, characterization, and inspection systems for use in the production of laminar substrates namely discrete electronic components, semiconductors including non-volatile and volatile memory devices, foundry and logic devices, asic devices, cmos image sensors, microelectromechanical systems, light emitting diodes, and other micro and nano technology devices, namely transistors, capacitors, resistors, and inductors, advanced packaging electronics technologies, namely system-in-package (SIP) and fan-out packages, chiplets, heterogeneous packaging, namely packaging comprising two different substrates, hybrid bonding, bumping, 3D structures, and scaling; operating software for optical metrology, characterization, and inspection systems for use in the production of precision machined optical surfaces, optical coatings, and optical assemblies including reference flat, sphere, asphere and assemblies composed of both refractive and reflective components

...

Lithography machines for the manufacture of microelectronics, integrat...

REGISTERED

on 23 Sept 2024

ONTO INNOVATION

ONTO INNOVATION INC.

2023842 · 12 Nov 2019

007

009

...

Lithography machines for the manufacture of microelectronics, integrat...

Owners

Onto innovation inc. (2)

Categories

Class 7 (2)

Class 9 (2)

Class 42 (2)

Correspondents

Borden ladner gervais llp (2)

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